Trade Lead Description:
1）Applied in semiconductor wafer’s cleaning and etching;
2）Process flow: Designed as customer required, used in cleaning, etching, plating, stripping, polishing and etc.
3）Control mode: Manual, semi-auto, Auto.;
4）Material: Depending on process and customer requirement, available matierials eg. PP, PVC, PVDF, Quartz Tube, Stainless steel and others;
Features and benefits:
A. Module design; Depending on customer requriment and process, offer special solution;
B. Customization based on customer budget;
C. Optimum wet cleaning solution;
D. High PPR;
E.Various options available:;
F. Operator friendly and safe;
G. Easy maintenance;
Non-standard product, please contact for special process solution with your requirement!
For more product infos, please download: CSE Semiconductor Product Catalogue.
Posted from China - Jiangsu on 5 November, 2009
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